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Electronics reliability

Lifetime reliability prediction

Electronics reliability for a lifetime

Many companies perform reliability prediction tests as an integral part of their development process, to ensure their products will survive in the field over the intended design lifetime. The challenge is to design tests which are as effective as possible in identifying and preventing the vulnerabilities that could result in failure.

Most companies have honed their testing to reflect the environments into which their products are deployed. We go further and address the challenges which come with:

  • new innovative products
  • integration into new systems
  • exposure to harsher environments
  • deployment to more remote locations
  • use in safety critical applications

We have extensive hands-on experience and are familiar with the most pertinent failure mechanisms and the most appropriate testing regimes.

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Our testing and analysis capability

Our experts are able to stress electronics and continously monitor the effect of varying temperature, current and environment. Rapid analysis of faults enables changes to be made and designs adapted to make the devices more reliable and robust.

Conditioning monitoring analysis

Stress and condition

Thermal shock (to 300°C)
Thermal cycling (-65 to 200°C)
Thermal ageing (to 300°C)
Humidity-bias (5 to 98%RH / up to 1000V)
Condensation testing
Power cycling (incl low vacuum)
Reflow soldering (simulated manufacturing)

Monitor and measure

Constant continuity monitoring (max 900 channels)
Electrical monitoring
Solvent extract conductivity (Ionic contamination)
Solderability testing
Tin whisker propensity
Adhesion testing (coatings)
Mechanical shock / Hot mechanical shock (to 250°C)
Shear / Hot shear
Pull / Hot pull
Solder joint reliability

Characterise and analyse

FIB (Focused Ion Beam)
XRF (X-Ray Florescence)
SEM (Scanning Electron Microscopy)
SAM (Scanning Acoustic Microscopy)
EDX (Energy Dispersive X-ray Spectra)
FTIR (Fourier-transform Infrared Spectroscopy)
EIS (Electrochemical Impedance Spectroscopy)
DSC (Differential Scanning Calorimetry)
DMA (Dynamic Mechanical Analysis)
TMA (Thermo Mechanical Analysis)
Micro-sectioning
Optical microscopy
X-ray radiography
Surface profiling
Surface free energy
Electrokinetic analyser

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Work with us

Our research and measurement solutions support innovation and product development. We work with companies to deliver business advantage and commercial success.
Contact our Customer Services team on +44 20 8943 7070

General enquiry