Our experts are able to stress electronics and continously monitor the effect of varying temperature, current and environment. Rapid analysis of faults enables changes to be made and designs adapted to make the devices more reliable and robust.
Stress and condition
Thermal shock (to 300°C)
Thermal cycling (-65 to 200°C)
Thermal ageing (to 300°C)
Humidity-bias (5 to 98%RH / up to 1000V)
Condensation testing
Power cycling (incl low vacuum)
Reflow soldering (simulated manufacturing) |
Monitor and measure
Constant continuity monitoring (max 900 channels)
Electrical monitoring
Solvent extract conductivity (Ionic contamination)
Solderability testing
Tin whisker propensity
Adhesion testing (coatings)
Mechanical shock / Hot mechanical shock (to 250°C)
Shear / Hot shear
Pull / Hot pull
Solder joint reliability |
Characterise and analyse
FIB (Focused Ion Beam)
XRF (X-Ray Florescence)
SEM (Scanning Electron Microscopy)
SAM (Scanning Acoustic Microscopy)
EDX (Energy Dispersive X-ray Spectra)
FTIR (Fourier-transform Infrared Spectroscopy)
EIS (Electrochemical Impedance Spectroscopy)
DSC (Differential Scanning Calorimetry)
DMA (Dynamic Mechanical Analysis)
TMA (Thermo Mechanical Analysis)
Micro-sectioning
Optical microscopy
X-ray radiography
Surface profiling
Surface free energy
Electrokinetic analyser |
Don’t see what you are looking for? Our diverse skill set enables us to provide bespoke solutions. Please contact us to discuss your requirements.
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