NPL is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research. These FREE online webinars provide the opportunity to draw on years of practical experience without leaving your desk. To participate, you need a phone line and Internet access. Please note that registration is essential.
The majority of webinars run for 60 minutes and each one is limited to 100 delegate/company registrations. A copy of each of the slides presented and links to NPL reports will be provided after the webinar. In preparation for the event and to ensure you are equipped to gain the maximum benefit, please read our simple Webinar Guidelines.
Tuesday 17th November 2.30pm UK Time
Title: Are tin-plated components a reliability time-bomb? An update on long term whisker testing at NPL and the importance of good coating coverage by Martin Wickham, Senior Research Scientist, NPL.
Abstract: During long-term whisker testing at NPL, unmitigated test samples have generally tended to generate whisker shorts in relatively short timescales. This is because the samples were purposely produced with compress stress plated into the component lead-frames, designed to drive early whisker growth. Electrical shorts were generally created within 100 days of manufacture. Long-term testing of mitigated whisker samples has shown that most coatings are successful at delaying or inhibiting Sn whiskers, but some samples have begun generated whisker shorts on SOIC components over much longer timeframes, most recently after 5 years on test. This webinar will present updated results from 12 years of testing with NPL’s parallel plate test vehicle and 6 years of testing with the SOIC component test vehicle. Details on recent work on the efficacy of condensation testing at determining coating coverage will be discussed.