Martin is a Senior Scientist in the Electronic & Magnetic Materials Group and has over 30 years’ experience in electronics interconnection and reliability.
His current interests are focused on high temperature and high voltage interconnects, harsh environment and power electronics reliability, printed electronics, Sn whiskers and sustainability in electronics manufacturing.
Projects in high temperature electronics lifetime prediction include work with innovative conductive adhesives and sintered interconnects.
Work in Sn whiskers includes mitigation using conformal coatings, electrostatic attraction, contact resistance measurement, oxide breakdown and whisker growth under electric fields.
Harsh environment electronics reliability work includes condensation testing, thermal cycling evaluations and temperature/humidity bias testing of electronic assemblies.
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