Nick Ridler is the Head of Science for NPL’s Electromagnetic & Electrochemical Technologies Department. He is an internationally-renowned expert in precision high-frequency electromagnetic measurements (from RF to terahertz frequencies), authoring or co-authoring over 200 publications in this field, and has over 35 years' experience working in industrial, government and academic research establishments. He is a Fellow of the IEEE (Institute of Electrical and Electronics Engineers), IET (Institution of Engineering and Technology), and IOP (Institute of Physics).
He is an Honorary Professor at the Universities of Glasgow (College of Science and Engineering) and Liverpool (Department of Electrical Engineering and Electronics), and, a Visiting Professor at the Universities of Kent (School of Engineering), Leeds (School of Electronic and Electrical Engineering) and Surrey (Faculty of Engineering and Physical Sciences). He is also a Non-Executive Director of LA Techniques Ltd (a UK SME based in Surbiton, Surrey) and Director of n3m-labs (the joint NPL/University of Surrey 'Nonlinear Microwave Measurement and Modelling Laboratories').
Nick has twice been the recipient of the IET Measurement Prize (in 1995 and 2005) and holds ten Best Paper awards from international scientific conferences. He takes lead roles in several international activities in this area, including:
- General Chair – European Microwave Week (EuMW), 2021
- IEC Representative – Joint Committee for Guides in Metrology (JCGM) 'Working Group on the Expression of Uncertainty in Measurement', 2015–present
- Chair and Founder – IEEE Standards Association: P1785 Working Group, 'Waveguides for Millimeter and Submillimeter Wavelengths', 2008–present
- Emeritus Chair – IEEE MTT-3 'Microwave Measurements' Technical Committee, 2003–present
- Past President – ARFTG (Automatic RF Techniques Group) Board of Directors, 2003–2015
Areas of interest
Nick's main area of interest is precision electromagnetic metrology in support of next-generation information and communications technologies and high-frequency electronics applications. This includes measurements at millimetre-wave and terahertz frequencies; nonlinear microwave network analysis; and, RF measurements on Printed Circuit Boards (PCBs).
Selected recent publications
- “Uncertainty of S-parameter Measurements on PCBs due to Imperfections in the TRL Line Standard”, H. Koo, M.J. Salter, N-W. Kang, N.M. Ridler, Y-P. Hong, J. Electromagn. Eng. Sci., 21(5):369-378 (2021).
- "Microwave Characterization of Conductive PLA and its Application to a 12 to 18 GHz 3-D Printed Rotary Vane Attenuator”, E. Marquez-Segura, S-H. Shin, A. Dawood, N.M. Ridler, S. Lucyszyn, IEEE Access, 9:84327-84343 (2021).
- “The Effect of Standing Waves on the Attenuation Constant for a Low-Loss Rectangular Waveguide”, R.J. Collier, N.M. Ridler, P.R. Young, Electron. Lett., 57(9):366-368 (2021).
- “Assessing the Impact of Data Filtering Techniques on Material Characterization at Millimeter-Wave Frequencies”, D. Ma, X. Shang, N.M. Ridler, W. Wu, IEEE Trans. Instrum. Meas., 70:1-4 (2021).
- “Polymer-based 3-D Printed 140-220 GHz Low-cost Quasi-optical Components and Integrated Subsystem Assembly”, S-H. Shin, X. Shang, N.M. Ridler, S. Lucyszyn, IEEE Access, 9:28020-28038 (2021).
- “Establishing waveguide lines as primary standards for scattering parameter measurements at submillimetre wavelengths”, N.M. Ridler, S. Johny, M.J. Salter, X. Shang, W. Sun, A. Wilson, Metrologia, 58(1):015015 (2021).
- "Comparing Standardized and Manufacturers’ Interfaces for Waveguides used at Submillimeter Wavelengths”, N.M. Ridler, S. Johny, X. Shang, W. Sun, A. Wilson, IEEE Trans. Terahertz Sci. & Technol.. 10 (5):453-459 (2020)
- “Characterization of Dielectric Materials at WR-15 band (50-75 GHz) using VNA-based Technique”, Y. Wang, X. Shang, N.M. Ridler, T. Huang, W. Wu, IEEE Trans. Instrum. Meas.. 69 (7):4930-4939 (2020)
- “Material Measurements Using VNA-based Material Characterization Kits Subject to Thru Reflect-Line Calibration”, Y. Wang, X. Shang, N.M. Ridler, M. Naftaly, A.I. Dimitriadis, T. Huang, W. Wu, IEEE Trans. Terahertz Sci. Technol.. 10 (5):466-473 (2020)
- “Calibration on the Fly—A Novel Two-Port S-Parameter Measurement Method for On-Wafer Leaky Systems”, A. Wu, C. Liu, F. Liang, X. Zou, Y. Wang, P. Luan, C. Li, N.M. Ridler, IEEE Trans. Microw. Theory Tech.. 68 (8):3558-3564 (2020)
- “3-D Printed Primary Standards for Calibration of Microwave Network Analysers”, A. Jones, S. Lucyszyn, E. Márquez-Segura, N.M. Ridler, J. Skinner, D. Stokes, Measurement, 158, 107682 (2020)
- “Terahertz wave generation using a soliton microcomb”, S. Zhang, J.M. Silver, X. Shang, L. Del Bino, N.M. Ridler, P. Del’Haye, Optics Express, 27(24):35257 (2019)
- “Polymer-based 3-D Printed Ku-band Steerable Phased-Array Antenna Subsystem”, S-H. Shin, D. Alyasiri, M. D’Auria, W.J. Otter, C.W. Myant, D. Stokes, Z. Tian, N.M. Ridler, S. Lucyszyn, IEEE Access, 7:106662-106673 (2019)
- “A Comparative Study of On-wafer and Waveguide Module S-Parameter Measurements at D-band Frequencies”, R. Lozar, M. Ohlrogge, R. Weber, N.M. Ridler, X. Shang, T. Probst, U. Arz, IEEE Trans. Microw. Theory Tech., 67(8):3475-3484 (2019)
- “Microwave Characterization of Low-loss FDM 3-D Printed ABS with Dielectric-filled Metal-pipe Rectangular Waveguide Spectroscopy”, J. Sun, A. Dawood, W.J. Otter, N.M. Ridler, S. Lucyszyn, IEEE Access, 7(1):95455-95486 (2019)
- “Breathable E-Textile Proven for RF Wearable Apps”, M. D’Auria, J. Greenwood, C. Hunt, M.J. Salter, N.M. Ridler, Microwaves & RF, 58(5):74-80 (2019)
- "Strategies for Traceable Submillimeter-wave Vector Network Analyzer Measurements", N.M. Ridler, R.G. Clarke, C. Li, M.J. Salter, IEEE Trans. Terahertz Sci. Technol., 9(4):392-398 (2019)
- "Propagating Measurement Uncertainty to Microwave Amplifier Nonlinear Behavioral Models", L.T. Stant, M.J. Salter, N.M. Ridler, D.F. Williams, P.H. Aaen, IEEE Trans. Microw. Theory Tech., 67(2):815-821 (2019)
- "Establishing a new form of primary impedance standard at millimeter-wave frequencies", Y. Azeez, R.J. Collier, N.M. Ridler, P.R. Young, IEEE Trans. Instrum. Meas., 68(1):294-296 (2019)