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Good practice guides

Reduce copper dissolution in lead-free assembly GPG110

During a successful soldering operation to a copper surface, a small amount of copper is dissolved to form a reliable interconnection and is perfectly normal. During the soldering operation, copper is dissolved by tin to form a tin/copper intermetallic and the amount dissolved is dependent on the soldering process, solder alloy, surfaces to be joined, temperature, time and solder flow rate. Using lead-free alloys requires higher soldering temperatures and potentially longer contact times, and hence the propensity for higher dissolution of copper. 


08 Jul 2020
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