During a successful soldering operation to a copper surface, a small amount of copper is dissolved to form a reliable interconnection and is perfectly normal. During the soldering operation, copper is dissolved by tin to form a tin/copper intermetallic and the amount dissolved is dependent on the soldering process, solder alloy, surfaces to be joined, temperature, time and solder flow rate. Using lead-free alloys requires higher soldering temperatures and potentially longer contact times, and hence the propensity for higher dissolution of copper.
08 Jul 2020
pdf
Our research and measurement solutions support innovation and product development. We work with companies to deliver business advantage and commercial success.
Contact our Customer Services team on +44 20 8943 7070