National Physical Laboratory

Flexible Circuits
Webinars

Electronics Interconnection webinar series

 


 




NPL's Electronics Interconnection Group is presenting a new series of technical webinars in 2018.

This Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research.

These FREE online webinars provide the opportunity to draw on years of practical experience without the participant needing to leave his/her desk – to participate, all that is needed is a phone line and Internet access. Please note that registration is essential.

The majority of webinars run for between 60–90 minutes (and is limited to 100 delegate/company registrations). After the webinar, participants receive a copy of all of the slides and a listing of all relevant technical reports which can be downloaded for FREE.

Please note that all webinars are at UK time - check local time in other countries here




Recordings of previous webinars are available here



EI webinars 2018: whisker images
1,000 days of testing Sn Whiskering PCB Assemblies to Determine the Suitability of Conformal Coatings to Mitigate Against Shorting
Presented by Martin Wickham

Tuesday 23 January 2018 (14:30 hrs UK time)

Book your place here

The spontaneous growth of tin whiskers leading to electrical short circuits has been an issue across avionics, space and other high reliability applications. Commercial satellites, nuclear reactors, missile systems and automotive applications have all reported complete or partial failures believed to be associated with tin whisker growth. The UK's National Physical Laboratory (NPL) has developed a test vehicle incorporating specially plated SOIC components mounted onto PCBs, which have a high propensity to develop tin whiskers. These test vehicles have been used to undertake trials on different mitigation techniques designed to inhibit Sn whisker growth. 17 international industrial partners have collaborated to determine the relative reliability of a range of different Sn whisker mitigation techniques, including twenty conformal coatings.

The experimental set up to measure the occurrence of electrical shorts has been built on a bespoke daisy chained SOIC16W, 24 of which are mounted on a PCB. Each SOIC is monitored for shorts between adjacent terminations by a resistance measurement. By multiplexing, the experiment has looked at over 3,500 components continuously up to 1,000 days, with over 48,000 opportunities for failure. The system has captured and stored the resistance state across all components every 15 minutes. The collected data permits the study of the incidence of short circuits, the length of time of each short and the number of intermittent short circuits. We will discuss the rapidity of whisker formation and the formation of intermittent shorts and their duration as the whisker continues to grow.

In preparation for the event and to ensure you are equipped to gain the maximum benefit, please read our simple Webinar Guidelines

The majority of webinars run for between 60–90 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.


Reliability and Fitness for Purpose Testing of Flexible and Wearable Electronics
Presented by Dr Adam Lewis

Tuesday 20 March 2018 (14:30 hrs UK time)

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Wearable electronics encompass a wide area of devices, including those embedded as flexibles, hybrid-systems and textiles. Typically in the electronics industry, we test the reliability of electronic assemblies using high humidity and high temperature as an accelerating factor. For many of the substrate materials involved, the use of high temperature is not appropriate to accelerate failure mechanisms to help predict device reliability. Additionally, high temperature is not always reflective of typical (or harsh) operating conditions for wearables, so we have investigated alternative suitable methods for testing these devices. Typical measurements include flex/bend testing, washing machine durability tests, stretch and stress testing. We are increasingly looking at methods for testing devices subjected to combinatorial harsh environments, where the test is composed of multiple stress factors which is more akin to real life use. Understanding the resulting failure modes observed from these tests is crucial for identifying the weak links limiting the device's reliability.

In preparation for the event and to ensure you are equipped to gain the maximum benefit, please read our simple Webinar Guidelines

The majority of webinars run for between 60–90 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.


Sebastian Wood
Performance and Lifetime of Printed Semiconductors
Presented by Dr Sebastian Wood

Tuesday 15 May 2018 (14:30 hrs UK time)

Book your place here

Printed semiconducting materials have great potential for a range of electronic applications, particularly where large active areas or flexible/stretchable devices are required. This class of materials is expanding rapidly, with specific interest currently in organic semiconductors and hybrid organic-inorganic lead-halide perovskites. As these materials begin to see commercial uptake, their short operational lifetime has become a critical limitation. NPL has developed a suite of tools for monitoring and understanding the degradation mechanisms affecting these devices in order to guide their ongoing development.

 

In preparation for the event and to ensure you are equipped to gain the maximum benefit, please read our simple Webinar Guidelines

The majority of webinars run for between 60–90 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.

Registration

Please note that the information will not be divulged to third parties, or used without your permission

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