News & Events

EI group launches a series of webinars
The EI group has launched a series of webinars covering the area of: Improving Electronic Reliability - Through Product & Process Qualification at NPL.
Further details and free downloadable videos

IPC APEX EXPO: Bob Willis Cleaning and Contamination Testing Center
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Recyclable Printed Circuit Boards
NPL and partners develop a printed circuit board that can be easily separated by immersion in hot water.
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Study: Prognostics of Electronic Interconnects
The EI group is launching a new project on prognostics and estimating remaining useful life. There was a short web conference on this project on Monday 25 June 2012.
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NPL research in electronics interconnections is carried out in close collaboration with industry and is aimed at developing new test methods, guidelines and procedures for use in the assembly of microelectronics. The research is disseminated to industry by reports and industry advisory group meetings.

NPL has made considerable contributions to solderability testing, participating in the writing of IEC standard 68-2-69 and IPC J-Std 002 and 003.

Achieving high reliability is an increasingly critical issue in today's manufacture, now that very low defect levels in manufacture are obtainable. In order to keep up with the rapid developments in a global market, NPL offers a range of suitable measurement methods to refine the assembly process and thus remain competitive. Services offered include confidential advice, consultancy case studies in issues relevant to production reliability and a range of measurement service facilities.