Measurement for Quantum - M4Q
Measurement for Quantum - M4Q
Electronic and magnetic materials

Electronics reliability webinars

A new series of technical webinars in 2020

NPL is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research. These FREE online webinars provide the opportunity to draw on years of practical experience without leaving your desk. To participate, you need a phone line and Internet access. Please note that registration is essential.

The majority of webinars run for 60 minutes and each one is limited to 100 delegate/company registrations. A copy of each of the slides presented and links to NPL reports will be provided after the webinar. In preparation for the event and to ensure you are equipped to gain the maximum benefit, please read our simple Webinar Guidelines.


Tuesday 13th April 2021 2.30pm UK time

Effect of high voltage (up to 1000V) on Dendrite Failures and Conductive Anodic Filament (CAF) Failures of Electronic Circuits presented by Ling Zou Abstract: Achieving high reliability in service is the key issue in today’s high density electronic circuits. The voltage applied to the electronic circuit plays a very important role in electrochemical reliability. Insulation Resistance (IR) measurement has been widely used to predict and evaluate the reliability of electronic circuits. The test voltages utilised for existing IR measurement are typically only up to 100V. With the significant increase in electrification of transport and corresponding increases in the voltages that electric vehicles operate, IR measurements need to be conducted at higher voltages to understand any potential new failure mechanisms.

NPL recently commissioned 1000V IR test facility has be used to characterise dendrite formation on PCB surface and Conductive Anodic Filament (CAF) formation inside PCBs at 1000V. Specially designed PCBs with different finishes and comb patterns of different pitches have been reflow soldered using different solder pastes and IR tested at 1000 V.

The effect of the increased test voltages on dendrite failure will be discussed. The results will also be compared with the CAF failures generated by NPL on similar pitch of via patterns.


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