Thermal analysis techniques for composites and adhesives (second edition).
- Author(s):
Mulligan, D R, Gnaniah, S J P, Sims, G D
- Source:
- Measurement Good Practice Guide No. 62, March 2003
- ISSN:
- 1368-6550
- ISBN:
- NPL Doc. Ref:
- PDB: 3408
- Document Type:
- Guide
- DOI:
Note: An asterisk after an author's name indicates a non-NPL author.
Abstract:
This Measurement Good Practice Guide covers five thermal analysis techniques; DSC, TMDSC, DMA, DEA and DTUL. Each technique is described and measurement issues are discussed. Precision statements based on inter-laboratory testing are presented for DSC, TMDSC and DMA. Recommended procedures for each technique are included in the Guide.Recommendations are made for the choice of technique for the measurement of degree-of-cure and measurement of service temperature for composites and adhesives. Although these measurements are related, they present different measurement challenges and the effectiveness of each technique for these measurements is discussed.
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