National Physical Laboratory

Residual stress in polymeric mouldings.

Author(s):

Turnbull, A, Maxwell, A S, Pillai, S, White, J R*

Source:
Measurement Good Practice Guide No. 10, October 1998
ISSN:
ISBN:
NPL Doc. Ref:
PDB: 2283
Document Type:
Guide
DOI:

Note: An asterisk after an author's name indicates a non-NPL author.

Abstract:

Thermoplastic polymer mouldings and thermoset mouldings often contain residual stresses which can cause distortion and may influence the fracture behaviour. This guide describes approaches to measurement of residual stress using layer removal, hole-drilling and chemical probe techniques. It will be of particular value to polymer processors, designers and materials testers.

Download Free Electronic Copy

Please log in or register to access this functionality.

Further Information

General information about NPL publications and details to contact the British Library for other published papers can be found on the NPL Publications Homepage.