National Physical Laboratory

Solderability

Glovebox
Solderability tester in inert atmosphere

Solderability is a parameter which indicates how well a component can be soldered. Solderability in SMT covers a range properties which determines the overall suitability of surfaces for soldering.

NPL has made considerable contributions to solderability testing, participating in the writing of the IEC standard 68-2-69, and sits on the IPC J-Std 002 and 003 committee.

NPL has run a number of projects looking at solderability issues:

Storage issues and the packaging environment

This work has been backed by in depth studies of intermetallic growth to predict ageing life.

Solderability of various OSP and other PCB metallic finishes

The study revealed the various process properties of these finishes.

Palladium finish

The research looked into the issue from a process implementation view point. A more detailed study looked at the various palladium finishes that are now available from a number of OEMs.

NPL has gathered all this expertise together and presents this in an easily digestible hands on workshop, which is held regularly. NPL also offers an expert rapid testing service, providing analysis useful in diagnosing production issues. A number of scientific reports are available upon request.

Current work at NPL is focused upon developing solderability testing of lead-free alloys in both air and inert (N2) atmospheres.

Last Updated: 14 Sep 2016
Created: 17 Oct 2007

Registration

Please note that the information will not be divulged to third parties, or used without your permission

Login