Ruptured solder joint 

Within the Electronics Interconnection group there is extensive expertise in the area of metallography and micro-sectioning of solders, for image analysis of various types of components and solder joints, substrates, vials, holes, etc.

We can provide high quality polished micrographs for various investigations, e.g. crack detection, and grain structure analysis, including size and morphology.

Contact

Customer Service tel: +44 20 8943 8681
E-mail: materials_enquiries@npl.co.uk