National Physical Laboratory

Improving Electronic Reliability - Through Product & Process Qualification at NPL - Downloads of past webinars - 2014

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Solderless Interconnect for Future Electronics Assembly
Wednesday 19 November 2014

This webinar summarised the work being undertaken at the UK's National Physical Laboratory to better understand electrical interconnection materials which can offer an alternative to Sn-based solders. The projects discussed included those involving both low temperature and harsh environment applications. Subject areas covered included use of sintered silvers and high temperature conductive adhesives for operation above 200 ºC for such applications as aerospace, oil and gas, and automotive. Low temperature interconnection for assembly at temperatures below 150 ºC for large area printed electronics, low cost printed sensors, smart packaging, wearable electronics and recyclable printed circuit assemblies were also discussed.

This webinar covered: Solderless interconnections  |  Sintered solders  |  High and low temperature materials  |  Wearable electronics  |  Printed electronics  |  Smart packaging

Using Surface Insulation Resistance (SIR) to Qualify Production Processes & Materials
Wednesday 10 September 2014

Surface Insulation Resistance (SIR) is a long-established technique for qualifying materials and processes in electronic assembly. SIR can be used to set up or monitor the reliability of an assembly process, which may include solder paste and liquid fluxes in combination with conformal coating or with a clean or no clean process. The test method may also be used for other applications to improve long term product reliability.

This webinar covered: Test methods and test assemblies  |  International specifications  |  Test procedures and materials required to conduct the test  |  Typical results and common failure modes  |  Listing of NPL related reports

Solderability Assessment - Testing, Ageing and Practical Impact on Assembly Yield
Tuesday 10 June 2014

There are different techniques that can be used for solderability assessment; however, the wetting balance is the one scientific test which provides absolute results which can be compared with printed board assembly yields. Direct measurement of wetting is ideal for measuring changes in solderability on components and printed boards, but there are other ways you can use this technique to improve yields and reduce costs.

This webinar covered: Test methods and PCB/component requirements for testing  |  International specifications  |  Typical test results and common failures found  |  Impact of ageing samples  |  Listing of NPL related reports

Effectiveness of Baking to Remove Moisture from Between PCB Ground Planes
Tuesday 18 March 2014

With the introduction of Pb-free solders there has been an increase in processing temperatures such that boards will have a greater risk of delamination in the reflow stage. To abate this risk, boards and components are baked prior to working to remove the internal moisture content. The flow of moisture is governed by the diffusion equation and moisture ingress, and removal from ground planes has been experimentally investigated and modelled. Results show that moisture removal is often unfeasible and that, in certain situations, a baking regime may actually increase local moisture content under a ground plane.

This webinar covered: Capacitance measurements of moisture content  |  Moisture ingression under ground planes  |  Diffusion modelling  |  Plated and non-plated through holes  |  Effect of hole density

How to Test and Qualify Packages with Scanning Acoustic Microscopy (SAM)
Tuesday 4 February 2014

Scanning Acoustic Microscopy (SAM) is a technique often used to examine electronic components for damage potentially caused by popcorning during soldering. It is a common failure analysis procedure which allows engineers to pinpoint the weaknesses of parts or demonstrate failure modes. SAM can also be used for PCBs and this webinar shows you how it can assist your process engineers.

This webinar covered: Test methods and components required during testing  |  International specifications  |  Typical results and common failures found  |  Listing of NPL related reports

Last Updated: 26 Jan 2015
Created: 4 Feb 2014


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