National Physical Laboratory

Improving Electronic Reliability - Through Product & Process Qualification at NPL - Downloads of past webinars - 2012

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Practical Applications for Nano Electronics
Wednesday 10 October 2012

The extraordinary properties exhibited by metallic carbon nanotubes, which arise from their perfect self-organised crystal structure, make these materials attractive candidates for electrical interconnects. This webinar looks at methodologies that being developed for implementation of CNT interconnect systems, synthesised at low temperature, in accordance with the ITRS roadmap. Another key aspect for industrial take-up is the development of dependable tests of performance and reliability, which due to the unique material properties will require innovative metrology. The challenges in this area are presented and the possible solutions discussed, which will include electromechanical measurements.

This webinar covers: Properties of CNTs  |  Adhesion of CNTs to surfaces  |  Wetting of CNTs with solder  |  Conditioning of CNTs in order to improve adhesion  |  Reliability testing of CNTs  |  Health and safety: what are the risks?

Review of Life Cycle Analysis (LCA) Modelling in the Development of RoHS & WEEE
Wednesday 15 August 2012

Over the past 10 years, several environmental impact and life-cycle assessments (LCA) have been carried out to assess the material substitutions that have occurred after the introduction of the RoHS legislation. By taking a retrospective view, it has been shown that in many cases there is not a significant environmental improvement in the substitution of lead, and for certain factors lead-free solders have more damaging impacts. This webinar reviews the findings from a number of environmental assessments, and evaluates the need for a full life life-cycle approach to be taken before legislation committing industries to costly materials substitution is put in place.

This webinar covers: Metal cycles and issues with silver, bismuth and other elements  |  Uncertainty in leachate and toxicology measurements  |  Outcomes from LCA studies  |  Impact of lead-free on global warming potentials

Practical Applications for Printed Electronics
Tuesday 3 July 2012

Printed electronics has received much press in recent times but is a technology with many advocates and few current applications. Whilst printed devices on low cost substrates may be the future, printed flexible interconnect is viable today. However, market penetration is being handicapped by lack of consumer confidence in fitness for purpose. This webinar discusses how printed electronics can be used for reliable, flexible interconnect on thermoplastic substrates.

This webinar covers: Using printed electronics today  |  Potential application areas for printed electronics in the shorter term
Reliability of printed interconnect  |  Printed electronics and recycling

Effectiveness of Baking to Remove Moisture from Between PCB Ground Planes
Thursday 7 June 2012

With the introduction of Pb-free solders there has been in increase processing temperatures such that boards will have a greater risk of delamination in the reflow stage. To abate this risk, boards and components are baked prior to working to remove the internal moisture content. The flow of moisture is governed by the diffusion equation and moisture ingress and removal from ground planes has been experimentally investigated and modelled. Results show that moisture removal is often unfeasible and that in certain situations a baking regime may actually increase local moisture content under a ground plane.

This webinar covers: Capacitance measurements of moisture content  |  Moisture ingression under ground planes  |  Diffusion modelling  |  Plated and non-plated through holes  |  Effect of hole density  |  Effect of temperature on diffusion coefficient  |  Storage considerations  |  Listing of NPL related reports

Assessment of Re-terminated RoHS Components for SnPb Applications
Wednesday 9 May 2012

There has long been concern in some market sectors that tin finish on PCBs and component terminations can lead to product or system failure due to tin whiskers. This failure mode has been seen in the field and in many reliability experiments. Changing the solderable finish on components after supply has long been seen as a solution to tin being the most widely available finish but what is the impact and reliability of the re-termination process?

This webinar covers: NPL project overview  |  Characterising components before and after re-termination  |  Optical and SAM assessment of components  |  Thermal cycling of test assemblies  |  Mechanical and microsection analysis

Impact of Copper Dissolution in Lead-Free Manufacture with Different Alloys
Wednesday 4 April 2012

Copper dissolution from PCBs in molten solder always occurs but with the introduction of lead-free alloys the dissolution rate increased. This was due to the higher process temperatures and that the alloys were higher tin content, hence the copper was more soluble. Factors affecting the dissolution rate include alloy composition, temperature, copper type, flow speed of the solder and the structure of the exposed copper. Selective soldering with typically higher solder temperatures are of particular concern with erosion around the knee of the PTH.

This webinar covers: Dissolution process and the formation of the IMC  |  Impact of using different alloys  |  How to measure dissolution rates  |  Copper dissolution, what do you look for?   |  Listing of NPL related reports   |  Monitoring dissolution during fabrication and assembly in the following processes: Rework solder fountain; Selective soldering processes; Wave soldering; PCB solder levelling; Manual soldering / de-soldering; Reflow soldering

Using Mechanical Testing to Diagnose Design, Product & Process Failures
Tuesday 21 February 2012

Often when a product fails in the field or in the assembly process you need to use mechanical testing to demonstrate the cause or where corrective action has improved the weakness in the process. Microsections, shear testing, dye and pry and temperature cycling are just a few of methods than can be used, but which is best and will convince management and your design team that no more failures will occur?

This webinar covers: Test methods and samples required for testing  |  International specifications  |  Correct sampling procedures  |  Typical results and common product failures  |  Listing of NPL related reports

Characterisation of Solder Joints, Test Methods & Typical Failure Modes
Tuesday 24 January 2012

Solder joints are reliable in electronic assemblies provided they are designed correctly; the solder volume is controlled along with the correct selection of alloy and mating faces. Considerable testing has been conducted over the years by NPL to help define actual reliability data and modelling of solder joints. This expertise allows the EI team to define the best test methods to prove a product is fit for purpose.

This webinar covers: Test methods and test samples required  |  International specifications  |  Correct sampling procedures  |  Typical results and common product failures  |  Listing of NPL related reports

Last Updated: 26 Jan 2015
Created: 28 Mar 2012


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