National Physical Laboratory

Improving Electronic Reliability - Through Product & Process Qualification at NPL - Downloads of past webinars - 2011

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Cleanliness Assessment Using Solvent Extract & Ionic Extraction to Improve Reliability
Thursday 24 November 2011

Setting the correct cleanliness levels for electronics to prevent premature failure is extremely important, particularly in safety critical applications. Accurate determination of cleanliness to existing standards and the need to quantify contamination types has become more important in printed board manufacture and prior to conformal coating. Different measurement systems and techniques exist and can be used for clean and no clean processes to monitor your company's performance and potential process improvement.

This webinar covers: Test methods and test samples required for testing  |  International specifications  |  Correct sampling procedures  |  Typical results and common product failures  |  Listing of NPL related reports



Using Surface Insulation Resistance (SIR) to Qualify Production Processes & Materials
Tuesday 8 November 2011

Surface Insulation Resistance (SIR) is a long established technique for qualifying materials and processes in electronic assembly. SIR can be used to set up or monitor the reliability of an assembly process which may include solder paste and liquid fluxes in combination with conformal coating or with a clean or no clean process. The test method may also be used for other applications to improve long term product reliability.

This webinar covers: Test methods and test assemblies  |  International specifications  |  Test procedures and materials required to conduct the test  |  Typical results and common failure modes  |  Listing of NPL related reports



How to Test & Qualify Packages with Scanning Acoustic Microscopy (SAM)
Thursday 27 October 2011

Scanning Acoustic Microscopy (SAM) is a technique often used to examine electronic components for damage potentially caused by popcorning during soldering. It is a common failure analysis procedure which allows engineers to pinpoint the weaknesses of parts or demonstrate failure modes. SAM can also be used and this webinar shows you how it can assist your process engineers.

This webinar covers: Test methods and components required during testing  |  International specifications  |  Typical results and common failures found  |  Listing of NPL related reports



Solderability Assessment – Testing, Ageing & Practical Impact on Assembly Yield
Tuesday 11 October 2011

There are different techniques that can be used for solderability assessment; however, the wetting balance is the one scientific test which provides absolute results which can be compared with printed board assembly yields. Direct measurement of wetting is ideal for measuring changes in solderability on components and printed boards but there are other ways you can use this technique to improve yields and reduce costs.

This webinar covers: Test methods and PCB/component requirements for testing  |  International specifications  |  Typical test results and common failures found  |  Impact of ageing samples  |  Listing of NPL related reports



X-Ray Fluorescence Testing Results with Laboratory & Handheld Systems
Thursday 8 September 2011

RoHS raised the need to test materials and components for compliance with banded substances like lead in electronic assemblies. However, there are misunderstandings on how to test parts, the readings obtained and interpretation of meaningful results. The EI team have had direct experience with laboratory and handheld systems and utilise their experience in testing customers' products for compliance.

This webinar covers: Theory of XRF and test methods  |  PCB/components requirements for testing  |  International specifications  |  Typical test results and common test failures  |  Listing of NPL related reports



Tin Whiskers Evaluation Techniques & Benefits of Conformal Coating
Wednesday 22 June 2011

A considerable amount of resources have been invested worldwide into understanding how tin whiskers grow and the potential for failures in electronics. Over the last few years the EI team have undertaken many projects for customers on testing products, but more recently created a test vehicle which allows the assessment of materials and other processes like conformal coating as a possible mitigator to whisker failure.

This webinar covers: Theory of operation and test methods  |  Material or samples for evaluation  |  Specifications or codes of practice  |  Typical test results and common test failures  |  Listing of NPL related reports

Last Updated: 26 Jan 2015
Created: 24 Jul 2013

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