National Physical Laboratory

Improving Electronic Reliability - Through Product and Process Qualification at NPL (webinar series)



NPL's Electronics Interconnection Group is presenting a new series of technical webinars in 2016.

Recordings of previous webinars are available here

This Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research.

These FREE online webinars provide the opportunity to draw on years of practical experience without the participant needing to leave his/her desk - to participate, all that is needed is a phone line and Internet access. Please note that registration is essential.

Each webinar lasts approximately 60 mins (and is limited to 100 delegate/company registrations). After the webinar, participants receive a copy of all of the slides and a listing of all relevant technical reports which can be downloaded for FREE.

Please note that all webinars are at UK time - check local time in other countries here




Impact of Surface Mount Rework on Reliability
Presented by Martin Wickham, NPL, and Bob Willis, NPL consultant

Wednesday 11 May 2016 (14:30 hrs UK time)

Book your place here

Does rework impact the reliability of modern printed board assemblies? What is the weak link in the chain and how could reliability be assessed? There is a limited amount of data on the impact of rework on printed board assemblies, even though some industry sectors say they do not allow rework. This webinar will look at some of the results of testing on solder joints and the impact re-terminating components and the possible problems associated with mixing lead-free solder alloys.

Topics covered:  Rework procedures  |  Rework failures on solder joints, components and PCBs  |  Reliability test results  |  Difficulty in the assessment of reliability rework

This webinar will run for between 45-60 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.


How Good Are Conformal Coatings at Preventing Sn Whisker Failures?
Presented by Martin Wickham, NPL

Wednesday 20 July 2016 (14:30 hrs UK time)

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For the last two years, NPL and industrial partners have been investigating conformal coating of assemblies as a mitigation strategy for tin whiskers by using a specially-designed test vehicle incorporating SM components. This webinar will provide details of the project, including the test methodology employed, with an update on results to date. Now the validity of the test vehicle has been proven, further work is planned and this will also be discussed.

Topics covered:  Conformal coating types  |  Coating coverage  |  Methods of testing coatings  |  Formation of tin whiskers  |  How do coatings reduce failure?

This webinar will run for between 45-60 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.


Development of Condensation Testing and Industry Benefits
Presented by Dr Chris Hunt, NPL

Wednesday 14 September 2016 (14:30 hrs UK time)

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NPL has developed a new test method to control the rate of condensation on to printed board assemblies during environmental testing. The method provided considerable improvements on existing industry standard tests and NPL's Electronics Interconnection Group is currently running a multi partner project to refine the test and fine criteria.

This webinar will provide an overview of the test methods and some results from other NPL SIR assessment projects in Europe.

Topics covered:  Review of existing test methods  |  Disadvantages of industry procedures  |  NPL condensation test benefits  |  Results of selected production trials

This webinar will run for between 45-60 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.


Solder Joint and Cleanliness Reliability Assessment in Production (Sweden Project)
Presented by Dr Chris Hunt and Ling Zou, NPL, and Bob Willis, NPL consultant

Wednesday 9 November 2016 (14:30 hrs UK time)

Book your place here

This webinar will look at results of different production trials conducted on test boards produced on two production lines as part of an NPL-supported project in Sweden. The tests conducted will look at a number of different soldering process and materials and the impact on solderability, solder joint formation, cleanliness and surface resistance. A special test board featuring QFN packages with SIR test coupons and other fine pitch and area array packages is being processed through no-clean and cleaning processes

Topics covered:  Assembly process for clean and no clean  |  Test board design  |  Test board assessment  |  Cleanliness results  |  SIR test procedure

This webinar will run for between 45-60 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.

Last Updated: 21 Mar 2016
Created: 4 Apr 2011

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