National Physical Laboratory

Improving Electronic Reliability - Through Product and Process Qualification at NPL (webinar series)



NPL's Electronics Interconnection Group is presenting a new series of technical webinars in 2017.

Recordings of previous webinars are available here

This Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research.

These FREE online webinars provide the opportunity to draw on years of practical experience without the participant needing to leave his/her desk - to participate, all that is needed is a phone line and Internet access. Please note that registration is essential.

Each webinar lasts approximately 60 mins (and is limited to 100 delegate/company registrations). After the webinar, participants receive a copy of all of the slides and a listing of all relevant technical reports which can be downloaded for FREE.

Please note that all webinars are at UK time - check local time in other countries here




Electrical Metrology for Flexible and Printed Electronics
Presented by Dr Adam P Lewis

Tuesday 12 September 2017 (14:30 hrs UK time)

Book your place here

The printed electronics market doubled from 2014 to 2015 and a similar growth has been predicted for 2016. To ensure high yield and reduced wastage, the development of metrology to evaluate the electrical properties and quality of printed devices is required. This method will need to be high speed and therefore non-contact in order to keep up with the manufacturing process. In this presentation, along with a discussion on metrology options for the printed electronics community, we will discuss the development of our solution for high speed, non-contact electrical metrology of printed electronics.

Topics covered:

  • Introduction to us of printed electronics
  • Practical applications
  • Non-contact measurements of sheet resistivity
  • Comparison with alternative metrology options
  • Sensor optimisation for wide range of ink technologies

This webinar will run for between 45-60 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.


Condensation Failure & Improved Testing for Electronic Assemblies
Presented by Ling Zou

Tuesday 14 November 2017 (14:30 hrs UK time)

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NPL has developed a new test method to control the rate of condensation on to printed board assemblies during environmental testing. The method provided considerable improvements on existing industry standard tests and NPL's Electronics Interconnection Group is currently running a multi-partner project to refine the test and fine criteria. This webinar provides an overview of the test methods and some results from other NPL SIR assessment projects in Europe.

Topics covered:

  • Review of existing test methods
  • Disadvantages of industry procedures
  • NPL condensation test benefits
  • Results of selected production trials

This webinar will run for between 45-60 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.

Last Updated: 12 Jul 2017
Created: 4 Apr 2011

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Please note that the information will not be divulged to third parties, or used without your permission

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