National Physical Laboratory

Improving Electronic Reliability - Through Product and Process Qualification at NPL (Webinar series)

NPL's Electronic Interconnection Group is presenting a new series of technical webinars in 2014.

Recordings of previous webinars are available here

This Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research.

These FREE online webinars provide the opportunity to draw on years of practical experience without the participant needing to leave his/her desk - to participate, all that is needed is a phone line and Internet access. Please note that registration is essential.

Each webinar lasts approximately 60 mins (and is limited to 100 registrations). After the webinar, participants receive a copy of all of the slides and a listing of all relevant technical reports which can be downloaded for FREE.

Please note that all webinars are at UK time - check local time in other countries here

Solderless Interconnect for Future Electronics Assembly
Presented by Martin Wickham, NPL

Wednesday 19 November 2014 (14:30 hrs UK time)

Book your place here

This webinar will summarise the work being undertake at the UK's National Physical Laboratory to better understand electrical interconnection materials which can offer an alternative to Sn-based solders. The projects discussed will include those involving both low temperature and harsh environment applications. Subject areas covered will include use of sintered silvers and high temperature conductive adhesives for operation above 200 ºC for such applications as aerospace, oil and gas, and automotive. Low temperature interconnection for assembly at temperatures below 150 ºC for large area printed electronics, low cost printed sensors, smart packaging, wearable electronics and recyclable printed circuit assemblies will also be discussed.

This webinar will cover:

  • Solderless interconnections
  • Sintered solders
  • High and low temperature materials
  • Wearable electronics
  • Printed electronics
  • Smart packaging

The webinar will run for between 45-60 minutes, with a Q&A session. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.


Last Updated: 11 Sep 2014
Created: 4 Apr 2011


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