National Physical Laboratory

Improving Electronic Reliability - Through Product and Process Qualification at NPL (Webinar series)


NPL's Electronic Interconnection Group is presenting a new series of technical webinars in 2014.

Recordings of previous webinars are available here

This Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research.

These FREE online webinars provide the opportunity to draw on years of practical experience without the participant needing to leave his/her desk - to participate, all that is needed is a phone line and Internet access. Please note that registration is essential.

Each webinar lasts approximately 60 mins (and is limited to 100 registrations). After the webinar, participants receive a copy of all of the slides and a listing of all relevant technical reports which can be downloaded for FREE.

Please note that all webinars are at UK time - check local time in other countries here




Solderability Assessment - Testing, Ageing and Practical Impact on Assembly Yield
Presented by Chris Hunt, NPL, and Bob Willis, NPL Defect Database Co-coordinator

Tuesday 10 June 2014 (14:30 hrs UK time)

Book your place here

There are different techniques that can be used for solderability assessment; however, the wetting balance is the one scientific test which provides absolute results which can be compared with printed board assembly yields. Direct measurement of wetting is ideal for measuring changes in solderability on components and printed boards, but there are other ways you can use this technique to improve yields and reduce costs.

This webinar will cover:

  • Test methods and PCB/component requirements for testing
  • International specifications
  • Typical test results and common failures found
  • Impact of ageing samples
  • Listing of NPL related reports

The webinar will run for between 45-60 minutes, with a Q&A session. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.



Using Surface Insulation Resistance (SIR) to Qualify Production Processes & Materials
Presented by Ling Zou

Wednesday 10 September 2014 (14:30 hrs UK time)

Book your place here

Surface Insulation Resistance (SIR) is a long-established technique for qualifying materials and processes in electronic assembly. SIR can be used to set up or monitor the reliability of an assembly process, which may include solder paste and liquid fluxes in combination with conformal coating or with a clean or no clean process. The test method may also be used for other applications to improve long term product reliability.

This webinar will cover:

  • Test methods and test assemblies
  • International specifications
  • Test procedures and materials required to conduct the test
  • Typical results and common failure modes
  • Listing of NPL related reports

The webinar will run for between 45-60 minutes, with a Q&A session. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.



Solderless Interconnect for Future Electronics Assembly
Presented by Martin Wickham, NPL

Wednesday 19 November 2014 (14:30 hrs UK time)

Book your place here

This webinar will summarise the work being undertake at the UK's National Physical Laboratory to better understand electrical interconnection materials which can offer an alternative to Sn-based solders. The projects discussed will include those involving both low temperature and harsh environment applications. Subject areas covered will include use of sintered silvers and high temperature conductive adhesives for operation above 200 ºC for such applications as aerospace, oil and gas, and automotive. Low temperature interconnection for assembly at temperatures below 150 ºoC for large area printed electronics, low cost printed sensors, smart packaging, wearable electronics and recyclable printed circuit assemblies will also be discussed.

This webinar will cover:

  • Solderless interconnections
  • Sintered solders
  • High and low temperature materials
  • Wearable electronics
  • Printed electronics
  • Smart packaging

The webinar will run for between 45-60 minutes, with a Q&A session. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.

Last Updated: 20 Mar 2014
Created: 4 Apr 2011