National Physical Laboratory

Characterisation of mechanical property of solder joint

Interconnect Properties Test machine (IPTM) 

A new instrument IPTM (Interconnect Properties Test machine) has been designed and built at NPL.

IPTM, with a bespoke sample geometry, permits small solder volumes to be studied in pure shear. IPTM can apply defined loading under precision displacement and force control to measure solder joint properties.

Material properties can be derived that are critical for calibrating modelling predictions. The total energy for a joint to fail can be measured. The sample arrangement allows for the copper to be plated with typical PCB finishes, and use any solder.

Common applications:

  • Determining solder joint reliability with new solder alloys, PCB finishes


Customer Service tel: +44 20 8943 8681

Last Updated: 2 Apr 2012
Created: 29 Jul 2009


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