Services
- A new instrument, Interconnect Properties Test machine (IPTM), has been designed and built at NPL. IPTM, with a bespoke sample geometry, permits small solder volumes to be studied in pure shear.
- NPL has three electron microscopes available for image analysis and elemental analysis.
- Introduction of RoHS has lead to component manufacturers moving away from SnPb component termination finishes to pure Sn.
- NPL's Electronic Interconnection Group will be presenting a series of technical webinars over the coming months.
- Download videos of past webinars.
- A shock testing system has been designed and built by the Electronics Interconnection group.
- Within the Electronics Interconnection group there is extensive expertise in the area of metallography and micro-sectioning of solders.
- Scanning Acoustic Microscopy (SAM) is a technique for studying buried solid interfaces of dissimilar materials.
- NPL has three electron microscopes available for image analysis and elemental analysis.
- Shear testing is an established destructive method for evaluating not only the degree of any crack propagation and damage to the solder joint, but also the general strength of the joint.