If you are interested in any of these reports, please contact Ling Zou

1. Impedance Testing for Sensitivity to Delamination in Printed Circuit Boards, C.P. Hunt, M Wickham, O Thomas, L Zou, MAT 40, March 2010
2. Reliability of Electronic Substrates After Processing at Lead-free Soldering Temperatures; Part 2, Martin Wickham and Christopher Hunt, & Bill Birch and Jason Furlong, PWB Interconnect Solutions Inc., Nepean, Canada, MAT 38, March 2010
3. Evaluation of the Ability of Conformal Coatings to Inhibit Tin Whiskering, Martin Wickham and Christopher Hunt, MAT36, December 2009
4. Allotropic transformation in tin and lead free solder alloys: Measuring the effect and implications for industry, Davide Di Maio and Christopher Hunt, MAT35, October 2009
5. Measuring Tin Whiskering Propensity:Measuring Internal Stress in Tin Coatings by Nanoindentation, Martin Wickham, Nigel Jennett, John Nunn, Dipak Gohil and Chris Hunt, MAT29, March 2009
6. Good Practice Guide to Reduce Copper Dissolution in Lead-Free Assembly, D. Di Maio, C. P. Hunt and B. Willis, Measurement Good Practice Guide No. 110, December 2008
7. Test Method for Measurement of the Propensity for Conformal Coatings to Inhibit Tin Whiskering, Martin Wickham and Christopher Hunt, MAT28, December 2008
8. Measurements of Copper Dissolution in Lead-Free Solder Alloys, Davide Di Maio Bob Willis,and Christopher Hunt, MAT26, November 2008
9. Investigation Methods of the β to α Tin Allotropic Transformation, Davide Di Maio and Christopher Hunt, MAT21, July 2008
10. On-wafer Testing of PCB Tracks as CPW Lines as a Production Assessment Method for Anisotropic Conductive Film Bonding, Martin Wickham, Martin Salter, Nick Ridler, Milos Dusek and Christopher Hunt, MAT 18, April 2008
11. Test Method for Recyclable Electronic Substrates Utilising Additive Technology, Martin Wickham, Ling Zou and Christopher Hunt, MAT 16, February 2008
12. Electrochemical Impedance Technique to Predict Circuit Reliability with Lead-free Solders, Ling Zou and Christopher Hunt, MAT 15, March 2008
13. Reliability of Electronic Substrates after Processing at Lead-free Soldering Temperatures, Martin Wickham, Milos Dusek and Christopher Hunt, MAT 10, December 2007
14. Preliminary Measurements for Thermoplastic Electronics: Developing a Stress Screening Test, Martin Wickham, Ling Zou and Christopher Hunt, MAT 6, November 2007
15. XRF Measurement of Residual Materials in Electronics, Martin Wickham and Christopher Hunt, MAT 4, October 2007
16. High-Frequency Vibration Tests of Sn-Pb and Lead-Free Solder Joints, D Di Maio and C Hunt, MAT 2, August 2007
17. Relative Reliability Measurements for Electrically Conductive Adhesive Joints on Subtractive Thermoplastic Substrates, M Wickham and C Hunt, MN 02, August 2007
18. Susceptibility of Lead-Free Systems to Electrochemical Migration, Ling Zou and Christopher Hunt, MAT 1, May 2007
19. Test Method for Conformal Coating Protection Performance of Electronic Assembly in Harsh Environments, Ling Zou and Christopher Hunt, DEPC-MPR 060, March 2007
20. Low Cycle Isothermal Fatigue Properties of Lead-free Solders, Miloš Dušek and Christopher Hunt, DEPC-MPR 058, January 2007
21. Protection Performance of Conformal Coatings in Harsh Environments, Ling Zou and Christopher Hunt, DEPC-MPR 054, July 2006
22. Test Approach to Isothermal Fatigue Measurements for Lead-free Solders, Miloš Dušek and Christopher Hunt, DEPC-MPR 048, March 2006
23. Statistical Analysis of the Effect of PCB Finish and Processing of Solder Joint on Integrity, Miloš Dušek and Christopher Hunt, DEPC-MPR 047, March 2006
24. Measuring the Reliability of Technology Demonstrator Manufactured with Isotropic Electrically Conductive Adhesives, M Wickham, L Zou And C P Hunt, DEPC-MPR 046, December 2006
25. Measuring the Effect on Isotropic Electrically Conductive Adhesive Reliability of Joint Design Characteristics, M Wickham, L Zou and C P Hunt, DEPC-MPR 045, March 2006
26. Measuring the Impact of Land Size and Solder Joint Volume on Lead-free Solder Joint Reliability, M Wickham, L Zou, M Dusek and C P Hunt, DEPC-MPR 044, March 2006
27. The Analytical Model II for Predicting Solder Joint Shape and Volume Impact on Life-time, Miloš Dušek and Christopher Hunt, DEPC-MPR 039, November 2005
28. Solderability Testing with Components Preheating, L Zou and C Hunt, DEPC MN 038, December 2005
29. Measuring the Impact of Component Solderability on Lead-Free Solder Joint Reliability, M Wickham, L Zou, M Dusek and C Hunt, DEPC-MPR 038, November 2005
30. Development of Preheat on Solderability Testing, L Zou and C P Hunt, NPL Report DEPC-MPR 036, September 2005
31. Effect of Voiding on Lead-Free Reliability, M Wickham, M Dusek, L Zou and C Hunt, NPL Report DEPC-MPR 033, April 2005
32. The Role of Permeability and Ion Transport in Conformal Coating Protection, A Mensah and C Hunt, NPL Report DEPC-MPR 032, September 2005
33. Measuring the Effect on Isotropic Electrically Conductive Adhesive Reliability of Substrate and Component Finishes, M Wickham, L Zou and C Hunt, NPL Report DEPC-MPR 031, August 2005
34. Measuring the Reliability of Electronics Assemblies during the Transition Period to Lead-Free Soldering, M Wickham, L Zou, M Dušek and C Hunt, NPL Report DEPC-MPR 030, August 2005
35. Guidelines for Measuring Anionic Contamination of Printed Circuit Boards (PCB) & Circuit Assemblies (PCA) using Ion Chromatography, L Zou, A Brewin and C Hunt, Measurement Good Practice Guide No 76, July 2005
36. Preliminary Measurements of Solder Flux Residues in an AC Environment, A Brewin, L Zou, M Dusek and C Hunt, NPL Report DEPC-MPR 029, August 2005
37. Effect of PCB Finish, Processing and Micro-Structure on Lead-Free Solder Joint Reliability, M Dusek, M Wickham & C Hunt, NPL Report DEPC-MPR 028, September 2005
38. Shear Strength of Lead-Free Solder Joints, Milos Dusek, Martin Wickham and Christopher Hunt, NPL Measurement Note MN57, March 2004
39. Measurement of Creep Rates and Stress Relaxation for Micro-Sized Lead-Free Solder Joints, Milos Dusek & Chris Hunt, NPL Report DEPC-MPR 021, April 2005
40. Developing a Stress Screening Regime for Isotropic Electrically Conductive Adhesives, Martin Wickham, Ling Zou and Chris Hunt, NPL Report DEPC-MPR 005, July 2004
41. Crack Detection Methods For Lead-free Solder Joints, Milos Dusek & Christopher Hunt, NPL Report MATC(A) 164, March 2004
42. Analytical Model for Thermal Cycling, Milos Dusek & Christopher Hunt, NPL Report MATC(A)163, March 2004
43. The Effect of Temperature on Microstructure of Lead-free Solder Joints, Thomas Le Toux, Milos Dusek & Christopher Hunt, NPL Report MATC(A)157, November 2003
44. The Impact of Thermal Cycle Regime on the Shear Strength of Lead-free Solder Joints, Milos Dusek, Martin Wickham & Christopher Hunt, NPL Report MATC(A)156, November 2003
45. Influence of Stencil and Aperture Design on Fine Pitch Printing for Various Solder Paste Types, M Wickham, L Zou, M Dusek and C P Hunt, MATC(A)145, September 2003
46. Code of Practice for the Use of Electronic Components and PCBs in Lead-Free Processing, M Wickham, A Brewin, L Zou and C Hunt, MATC(A)141, April 2003
47. A Test Procedure for Measuring Print Quality, Miloš Dušek and Christopher Hunt, MATC(A)129, September 2002
48. A Test Procedure for Measurement of Solder Volume Effect on Reliability, Miloš Dušek and Christopher Hunt, MATC(A)128, September 2002
49. Design Guidelines for Ultra Fine Pitch Solder Paste Printing, Martin Wickham, Ling Zou, Milos Dusek, and Christopher Hunt, MATC(A)127, September 2002
50. Development of New Solderability Test Fluxes, Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)122, September 2002
51. Test Procedure for Process Validation With Surface Insulation Resistance; Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)121, September 2002
52. A Comparison Of Automatic Optical Inspection Systems For Use With Lead-Free Surface Mount Assemblies, Martin Wickham & Christopher Hunt, MATC(A)119, July 2002
53. Rheology Testing of Solder Pastes and Conductive Adhesives – A Guide, Miloš Dušek, Ling Zou and Christopher Hunt, MATC(A)109, April 2002
54. Test Methods for Evaluating the Reliability of PCB Finishes using Lead-Free Alloys - A Guide, Milos Dusek and Christopher Hunt, MATC(A)107, April 2002
55. Rework of Mixed Lead-Free Alloys - A Guide, Martin Wickham, Alan Brewin & Christopher Hunt, MATC(A)106, April 2002
56. Rheology Testing of Solder Pastes and Conductive Adhesives Using in Stencil Printing, Miloš Dušek, Ling Zou and Christopher Hunt, MATC(A)102, May 2002
57. A Review of Electronics Materials Deposition Techniques including Solder Jetting and Relief Printing, Martin Wickham, Ling Zou, Milos Dusek and Christopher Hunt, MATC(A)92, April 2002
58. An Assessment of the Suitability of Current PCB Laminates to Withstand Lead-free Reflow Profiles, Martin Wickham, Ling Zou andChristopher Hunt, MATC(A)91, April 2002
59. Compatibility of Lead-free Solders with PCB Materials, Miloš Dušek, Jaspal Nottay and Christopher Hunt, MATC(A)89, August 2001
60. Test Method for Dispensing of Electronic Process Materials, Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)86, March 2002
61. Reliability of Joints Formed with Mixed Alloy Solders, Alan Brewin, Christopher Hunt, Milos Dusek & Jaspal Nottay, MATC(A)85, April 2002
62. Predicting Microstructure of Mixed Solder Alloy Systems, Jaspal Nottay, Alan Brewin, Alan Dinsdale and Christopher Hunt, MATC(A)83, December 2001
63. Code of Practice for Electronic Materials Dispensing, Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)82, December 2001
64. Stability of Electronic Components in Lead-Free Processing, Alan Brewin, Ling Zou, and Christopher Hunt, MATC(A)79, December 2001
65. Assessment of Rheological Properties of Materials used in Printing and Dispensing, Miloš Dušek and Christopher Hunt, MATC(A)76, December 2001
66. Reworking Solder Alloy Mixtures of Lead-free and Tin-Lead Alloys, Jaspal Nottay, Milos Dusek, Martin Wickham and Christopher Hunt, MATC(A)73, October 2001
67. Development of Surface Insulation Resistance Measurements For Electronic Assemblies, Christopher Hunt, MATC(A)70, October 2001
68. A Review of Mechanical Test Method Standards for Lead-Free Solders, Martin Wickham, Jaspal Nottay and Christopher Hunt, MATC(A)69, October 2001
69. Stencil Printing of Surface Mount Adhesive and Conductive Adhesive, Ling Zou, Milos Dusek, Martin Wickham & Christopher Hunt, MATC(A)55
70. Creep Properties of SnAgCu solder in Surface Mount Assemblies, Jaspal Nottay, Milos Dusek and Christopher Hunt, MATC(A)51, August 2001
71. Thermal Profiling of Electronic Assemblies, Martin Wickham and Christopher Hunt, MATC(A)50, August 2001
72. Processability of Lead-Free Component Termination Materials, Martin Wickham, Deborah Lea, Jaspal Nottay & Chris Hunt, MATC(A)47, August 2001
73. Test Method for the Measurement of Tensile and Shear Tack for Electronic Solder Pastes and Adhesives, Alan Brewin & Christopher Hunt, MATC(A)031, June 2001
74. Tack of Electronic Adhesives in Tension and Shear, Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)030, April 2001
75. Tack Testing of Solder Paste in Tension and Shear, Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)029, February 2001
76. The Effect of Solder Alloy, Metal Particle Size and Substrate Resist on Fine Pitch Stencil Printing Performance, Ling Zou, Milos Dusek, Martin Wickham and Christopher Hunt, MATC(A)018, August 2001
77. Technology Mission to Assess the Status of Lead-free Soldering in Japan, Christopher Hunt, MATC(A)012, March 2001
78. An Experimental Validation of Modelling for Pb-free Solder Joint Reliability, Miloš Dušek, Jaspal Nottay, Christopher Hunt, Hua Lu and Christopher Bailey, MATC(A) 11, October 2001
79. The Effect of Metal Content and Flux Chemistry on Fine Pitch Stencil Printing Performance Using an Enclosed Print Head, Ling Zou, Milos Dusek, Martin Wickham and Christopher Hunt, MATC(A) 10, August 2001
80. Fine Pitch Stencil Printing Using Enclosed Printing Systems, Ling Zou, Milos Dusek, Martin Wickham and Christopher Hunt, MATC(A) 09, August 2001
81. A novel measurement technique for stencil printed solder paste, Milos Dusek and Christopher Hunt, NPL MATC(A) 08
82. Solderability Measurements of PCB Pad Finishes and Geometries, Deborah Lea, Fredirikus Jonck and Christopher Hunt, MATC(A)003, July 2001
83. Solderability of Electronic Components and Copper using Lead-Free Alloys, Deborah Lea, Milos Dusek, Fredirikus Jonck and Christopher Hunt, CMMT(A)284, September 2000
84. Best Practice Guide for Thermocycling and Reliability Assessment of Solder Joints, Miloš Dušek and Christopher Hunt, CMMT(A)274, July 2000
85. A Test Methodology for Assessing Pb-free Solder Joint Reliability, Miloš Dušek, Jaspal Nottay, Christopher Hunt, CMMT(A)273, July 2000
86. The Use of Shear Testing and Thermal Cycling for Assessment of Solder Joint Reliability, Miloš Dušek, Jaspal Nottay and Christopher Hunt, CMMT(A)268, June 2000
87. Tack Testing: Critique and Recommendations for a New Test, Christopher Hunt, CMMT(A)253, January 2000
88. Fine Pitch Paste Stencil Printing using Enclosed Printing Heads, Martin Wickham, Miloš Dušek & Christopher Hunt, CMMT(A)247, January 2000
89. Development of a New Surface Insulation Resistance (SIR) Test Method, Christopher Hunt & Ling Zou, CMMT(A)235, December 1999
90. The Effect of Test Voltage, Test Pattern and Board Finish on Surface Insulation Resistance (SIR) Measurements for Various Fluxes, Ling Zou & Christopher Hunt, CMMT(A)222, September 1999
91. A Comparison of Automatic Optical Inspection and Automatic X-ray Inspection of Surface Mount Assemblies, Martin Wickham & hristopher Hunt, CMMT(A)234, August 1999
92. Influence of Rework Conditions on Microstructure in Tin-Lead Solder Joints, Simon Green & Christopher Hunt, CMMT(A)216, August 1999
93. Optimum Pad Design and Solder Joint Shape for Reliability, Miloš Dušek & Christopher Hunt, CMMT(A)215, August 1999
94. The Impact of Solderability on Reliability and Yield of Surface Mount Assembly, Miloš Dušek & Christopher Hunt, CMMT(A)214, September 1999
95. Solderability Measurements with Lead-Free Alloys, Simon Green, Deborah Lea and Christopher Hunt, CMMT(A)213, August 1999
96. Improving the Processability of Noble Metal Component Termination Finishes, Martin Wickham, Miloš Dušek, Ling Zou, Christopher Hunt, CMMT(A)199, August 1999
97. Measuring Material Properties of Electronic Assembly Substrates, W Broughton, M Lodeiro, C Hunt, R Morrell, D Salmon, D Lea and S Gnaniah, CMMT(C) 50, July 1999
98. Benchmarking Assisted & Automatic Optical Inspection of Electronic Assemblies, Martin Wickham & Christopher Hunt, CMMT (A) 173, April 1999
99. Stencil Printing Codes of Practice, Christopher Hunt & Martin Wickham, CMMT (A) 165, February 1999

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