National Physical Laboratory

The Future of High Temperature Interconnect

ELCOSINT logo [400x185]

The Future of High Temperature Interconnect. NPL participation in the ELCOSINT project was subject of a webinar

The webinar covered the development of an alternative for high Pb solders. The material will be suitable for operating at temperatures above 250 ºC utilising standard manufacturing processes

We are also grateful for a write up by I-Connect007

Find out more about the ELCOSINT project

The Future of High Temperature Interconnect webinar

For more information, please contact Martin Wickham

Last Updated: 24 Sep 2015
Created: 23 Sep 2015

Registration

Please note that the information will not be divulged to third parties, or used without your permission

Login