National Physical Laboratory

Organic Electronics Emerging Electronics

Emerging electronics makes use of novel materials and novel manufacturing processes to create electronic devices that can be easily integrated into a wide range of products: from large area flexible electronics to wearables and implantable electronic devices. Understanding the impact of processing on material properties and device performance/reliability is critical.

Durability / lifetime management of materials: investigation of degradation mechanisms, device failure analysis, accelerated testing

Traceable facility for Water Vapour Transmission Rate (WVTR) measurements through barrier layers

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Mechanical characterisation

Nano indentation and AFM based nanoindentation: Modulus, creep, hardness and impact properties on the nano-scale

Surface Acoustic wave spectroscopy

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Morphological characterisation

Scanning Electron Microscopy (SEM) with EDX and WDX analysis

Field emission SEM: high-resolution images of nanoscale topographic features

Electron back-scattering diffraction (EBSD)

Confocal and optical microscopy: surface topography

White-light interferometry: surface roughness, topography

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Opto-electrical measurements

Display metrology

Electro-absorption: built-in electric field

Dark injection transient spectroscopy: charge mobility

Probe station with inert atmosphere and variable temperature linked to semiconductor parameter analyzer

Class AAA: solar cell efficiency, current-voltage curves

Incident photon-to-current conversion efficiency (external quantum efficiency): spectral photoresponse for solar cell characterization

Micro to millimeter scale photocurrent mapping (up to 225 cm2 samples)

Electrical characterisation of interconnects: linearity, eddy current, TDR



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Scanning probe microscopies

Atomic force microscopy: topography

Scanning Kelvin probe (atmospheric and ultra high vacuum): workfunction

(Photo)conductive AFM: nanoscale (photo)current response

Scanning Thermal Microscopy: nanoscale thermal properties


Surface analysis

X-ray photoelectron spectroscopy: surface chemical composition

Ultraviolet photoelectron spectroscopy: material workfunction

Secondary ion mass spectrometry: chemical depth profiling

Contact angle measurement: surface energy mapping for print deposition characterisation

Raman spectroscopy: chemical mapping (micrometer and nanometer spatial resolution methods)

Spectroscopic: film thickness and optical properties


Thermal analysis: Thermal conductivity, thermal diffusivity, thermal transmittance, heat capacity and thermal expansion.

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Clean room for sample preparation and processing (class 1000 and class 100): spin coater, wire bar coater, thermal evaporation, e-beam evaporation, lithography


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