Modelling Heat Transfer in Polymer Processing
Background
The concept of thermal resistances R (m².K)/W is invaluable for studying the thermal behaviour of a series of elements (layers) with interfaces, the elements being represented by their thermal conductivity and the interfaces by their heat transfer coefficient. The total thermal resistance of the layered structure, R, is given by the sum of the thermal resistances, ri, of all the elements and interfaces. (From this point on, an upper case R is used to denote directly measurable quantities (using Equation 7) whereas lower case r is used to denote component thermal resistances.) The thermal resistance of an element or interface is given by:
where δτ is the temperature difference and q the heat flux. For a specimen of thickness x, with temperatures Th and Tc at the bottom (hot) and top (cold) surfaces respectively, and heat flux q (W/m2) through the specimen, the thermal conductivity λ (W/(m. K)) is given by:
Similarly, the heat transfer coefficient h, W/(m2K) at the interface of two surfaces in contact is given by:
where Th is the temperature at the 'hot' interface side and Tc is the temperature at the 'cold' interface side. For an element (layer) of thickness xl then using Equations 1 and 2:
and for an interface with heat transfer coefficient hi using Equations 1 and 3:
Thus the total thermal resistance of a layered structure of elements and interfaces can be expressed as:
where hi is the heat transfer coefficient of the ith interface, and λl the thermal conductivity of the lthlayer of thickness xl.
For the instrument the measured thermal resistance Ri is given by:
where Th is the lower 'hot' plate temperature, Tc is the upper 'cold' plate temperature and q is the heat flux.
Analysis for heat transfer coefficients across polymer-steel interfaces (page 4)







