Scanning Acoustic Microscopy (SAM) is a technique for studying buried solid interfaces of dissimilar materials. The technique uses ultrasonic waves reflecting or transmitting at material interfaces. Features such as bonded interfaces, delaminated interfaces, voids and cracks can be detected non-destructively.

Examination of Plastic Encapsulated Devices (PEDs) using SAM 

Common applications

• Detection of voids and cracks in die and moulding compounds
• Plastic, ceramic, BGA and Flip Chip IC package analysis
• Evaluations of die attach integrity
• Assessing integrity of seals and bonding for shielding or hermetic cases