Electron Speckle Pattern Interferometry (ESPI)
The technique is particularly suitable for monitoring and measuring non-uniform strain fields at high resolution. Full field imaging of deformation with a resolution of 0.1 microns.
Measurements can be done on a variety of materials and the deformations under mechanical and thermal loads can be measured along three perpendicular axis without contact with the sample. Test samples require little or no preparation. Validations of FEA and other analysis predictions are also possible.
Various NPL publications are also available.

