National Physical Laboratory

Solder joint reliability testing

Solder joint reliability testing 

Solder joint fatigue occurs by low cycle fatigue, driven by the mismatch of the coefficients of thermal expansion (CTE).

NPL has considerable experience in designing and testing circuit assemblies to discover the weak links in interconnect design.

We have cycling chambers capable of thermal profiles between -55 and 150 °C with ramp speeds of up to 10 °C per minute.

Common applications involved the acceleration of Thermal Coefficient of Expansion (TCE) induced failures:

  • Solder joint cracking
  • Adhesive loss of glob tops and underfills
  • Delamination in multilayer boards and modules


Customer Service tel: +44 20 8943 8681

Last Updated: 25 Mar 2010
Created: 30 Jul 2009


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