NPL's Electronic Interconnection Group is presenting a new series of technical webinars in 2012.

Links to recordings of the previous webinars are available here

This Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research.

These FREE online webinars provide the opportunity to draw on years of practical experience without the participant needing to leave his/her desk.

Each webinar lasts approximately 60 mins (and is limited to 100 registrations). After the webinar, participants receive a copy of all of the slides and a listing of all relevant technical reports which can be downloaded for FREE.

The Group also hosts an annual European technical seminar at its facility at Teddington, UK, which includes a tabletop exhibition. The 2012 event will be held on Tuesday 20 November 2012 - detailed information on the topics covered will be available shortly.

• Thurs 7 June 2012 - Effectiveness of Baking to Remove Moisture from Between PCB Ground Planes
• Tues 3 July 2012 - Practical Applications for Printed Electronicsx
• Wed 15 August 2012 - Review of Life Cycle Analysis (LCA) Modelling in the Development of RoHS & WEEE
• Wed 17 October 2012 - Practical Applications for Nano Electronics

Effectiveness of Baking to Remove Moisture from Between PCB Ground Planes

Thursday 7 June 2012 (2:30 - 4:00 pm BST)

To register on this FREE webinar click here

With the introduction of Pb-free solders there has been in increase processing temperatures such that boards will have a greater risk of delamination in the reflow stage. To abate this risk, boards and components are baked prior to working to remove the internal moisture content. The flow of moisture is governed by the diffusion equation and moisture ingress and removal from ground planes has been experimentally investigated and modelled. Results show that moisture removal is often unfeasible and that in certain situations a baking regime may actually increase local moisture content under a ground plane.

The webinar will last for approximately 60 mins with questions and will cover:

• Capacitance measurements of moisture content
• Moisture ingression under ground planes
• Diffusion modelling
• Plated and non-plated through holes
• Effect of hole density
• Effect of temperature on diffusion coefficient
• Storage considerations
• Listing of NPL related reports

Practical Applications for Printed Electronics

Tuesday 3 July 2012 (2:30 - 4:00 pm BST)

To register on this FREE webinar click here

Printed electronics has received much press in recent times but is a technology with many advocates and few current applications. Whilst printed devices on low cost substrates may be the future, printed flexible interconnect is viable today. However, market penetration is being handicapped by lack of consumer confidence in fitness for purpose. This webinar will discuss how printed electronics can be used for reliable, flexible interconnect on thermoplastic substrates.

The webinar will last for approximately 60 mins with questions and will cover:

• Using printed electronics today
• Potential application areas for printed electronics in the shorter term
• Reliability of printed interconnect
• Printed electronics and recycling

Review of Life Cycle Analysis (LCA) Modelling in the Development of RoHS & WEEE

Wednesday 15 August 2012 (2:30 - 4:00 pm BST)

To register on this FREE webinar click here

Over the past 10 years, several environmental impact and life-cycle assessments (LCA) have been carried out to assess the material substitutions that have occurred after the introduction of the RoHS legislation. By taking a retrospective view, it has been shown that in many cases there is not a significant environmental improvement in the substitution of lead, and for certain factors lead-free solders have more damaging impacts. This webinar reviews the findings from a number of environmental assessments, and evaluates the need for a full life life-cycle approach to be taken before legislation committing industries to costly materials substitution is put in place.

The webinar will last for approximately 60 mins with questions and will cover:

• Metal cycles and issues with silver, bismuth and other elements
• Uncertainty in leachate and toxicology measurements
• Outcomes from LCA studies
• Impact of lead-free on global warming potentials

Practical Applications for Nano Electronics

Wednesday 17 October 2012 (2:30 - 4:00 pm BST)

To register on this FREE webinar click here

The extraordinary properties exhibited by metallic carbon nanotubes, which arise from their perfect self-organised crystal structure, make these materials attractive candidates for electrical interconnects. This webinar will look at methodologies that being developed for implementation of CNT interconnect systems, synthesised at low temperature, in accordance with the ITRS roadmap. Another key aspect for industrial take-up is the development of dependable tests of performance and reliability, which due to the unique material properties will require innovative metrology. The challenges in this area will be presented and the possible solutions discussed, which will include electromechanical measurements.

The webinar will last for approximately 60 mins with questions and will cover:

• Properties of CNTs
• Adhesion of CNTs to surfaces
• Wetting of CNTs with solder
• Conditioning of CNTs in order to improve adhesion
• Reliability testing of CNTs
• Health and safety: what are the risks?