Test methods for evaluating the reliability of PCB finishes using lead-free alloys - a guide.
- Author(s):
- Dusek, M, Hunt, C
- Source:
- NPL Report MATC(A)107, April 2002
- ISSN:
- 1473-2734
- ISBN:
- NPL Doc. Ref:
- PDB: 3077
- Document Type:
- NPL Report
- DOI:
Note: An asterisk after an author's name indicates a non-NPL author.
Abstract:
This guide recommends and details best practice for short-term accelerated thermal cycling as a method of assessing the compatibility (and hence joint reliability) of lead-free solders with the materials of the PCB assembly. The assessment involves electrical continuity and shear test measurements complemented with microstructural observations. Data for various PCB materials assessed using the test method described are reported in MATC(A)89 ' Compatibility of lead-free solders with PCB materials'.
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