Solder Joint Reliability from Materials Properties
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Testing the properties of various material joint designs under mechanical and heat stress.
This research aimed to discover which types of solder joint degrade more easily in particular conditions and at what point complete joint failure occurs. A variety of methods are used, including the use of time-lapse photography to see exactly where the most strain occurs and so where joints need to be strongest. Sample designs of real joints were tested to ensure relevance.
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