Rheology testing of solder pastes and conductive adhesives - a guide.
- Author(s):
- Dusek, M, Zou, L, Hunt, C
- Source:
- NPL Report MATC(A)109, May 2002
- ISSN:
- 1473-2734
- ISBN:
- NPL Doc. Ref:
- PDB: 3134
- Document Type:
- NPL Report
- DOI:
Note: An asterisk after an author's name indicates a non-NPL author.
Abstract:
This guide discusses rheology practice for measuring solder paste and conductive adhesives. The main parameter, viscosity, can be measured to assess the flow properties of printing media. Additional tests can be conducted to assess the viscoeleastic properties of printing media as a response to an oscillating shear stress at various frequencies. The rheology of printing materials is a complex science and as illustrated in this report cannot be simplified to a single static viscosity reading.
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