National Physical Laboratory

Residual stress measurement: XRD depth profiling using successive material removal.

Author(s):
Fry, A T
Source:
NPL Report MATC(MN)34, September 2002
ISSN:
1473-2742
ISBN:
NPL Doc. Ref:
PDB: 3237
Document Type:
NPL Report
DOI:

Note: An asterisk after an author's name indicates a non-NPL author.

Abstract:

As part of a continuing effort to improve and refine residual stress measurement using XRD technique, NPL has recently completed a series of measurements on a nickel based superalloy, which had been homogeneously shot-peened. The purpose of these measurements was to investigate and illustrate how progressive material removal can significantly relax the stresses generated by peening.

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