- Author(s):
- Nottay, J S, Rides, M
- Source:
- NPL Report DEPC-MN 013, March 2005
- ISSN:
- 1744-3911
- ISBN:
- NPL Doc. Ref:
- PDB: 4098
- Document Type:
- NPL Report
- DOI:
Note: An asterisk after an author's name indicates a non-NPL author.
Abstract:
This Measurement Note describes a pendant drop shape analysis method that was used to determine the surface tension of a range of hot melt adhesives under typical elevated temperature processing conditions. As part of these measurements, densities for the liquid adhesives were measured using Archimedes principle.Hot melt adhesives are polymeric materials that are applied to substrates in a molten form and develop mechanical strength on cooling. Surface tension, controlling drop formation, wetting andcapillary penetration, is an important property of the adhesive. Four grades of packaging hot melt adhesives and five pressure-sensitive hot melts were studied at 110 °C, 130 °C and 150 °C. The surface tension values obtained were around 20 mN/mm, these are typical values for liquid hydrocarbons.The work was carried out as part of the Measurements for Materials Systems (MMS) programme funded by the Department of Trade and Industry.
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