National Physical Laboratory

Code of practice for dispensing electronic materials.

Author(s):
Brewin, A, Zou, L, Hunt, C
Source:
NPL Report MATC(A)82, December 2001
ISSN:
1473-2734
ISBN:
NPL Doc. Ref:
PDB: 3123
Document Type:
NPL Report
DOI:

Note: An asterisk after an author's name indicates a non-NPL author.

Abstract:

Robotic dispensing provides flexibility for electronics production not possible from screen-printing processes. As well as the application of solder paste and surface mount adhesive, dispensing systems are utilised with newer technologies such as the application of conductive adhesives, chip-on-board glob-tops and flip-chip underfills.This document gives practical guidance for the dispensing of these materials for printed circuit assembly production.

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