Best practice guide for thermocycling and reliability assessment of solder joints.
- Author(s):
- Dusek, M, Hunt, C
- Source:
- NPL Report CMMT(A)274, July 2000
- ISSN:
- 1361-4061
- ISBN:
- NPL Doc. Ref:
- PDB: 2309
- Document Type:
- NPL Report
- DOI:
Note: An asterisk after an author's name indicates a non-NPL author.
Abstract:
This guide recommends best practice used for short-term accelerated thermal cycling as a method for assessing solder joint reliability. These techniques (shear testing, and electrical continuity measurements, complemented with microstructural investigations) are described.
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