This webinar will cover work undertaken at NPL on BGA reliability. The effect of voiding in BGA solder joints has been investigated and details of the project results will be discussed. The effect of uneven solder joint stand-off height due to pop-corning in components has also been studied. Its effect on solder joint reliability has been measured and details of the project outcome will be given.

Topics covered:

• BGA voiding
• Uneven BGA stand off height
• BGA reliability
• Thermal cycling and reliability

The webinar will run from 14:30 hrs UK time (check local time in other countries here) - for between 45-60 minutes, and will include a Q&A session.

The NPL Electronics Interconnection (EI) Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker mitigation and conformal coating research.