This webinar will touch on two important measurement topics: evaluation of coating protection and measuring the performance of high temperature interconnects. Ranges of coating materials are now available with varied properties that can be selected for specific applications. The webinar will discuss how the protection can be measured using SIR testing. The results highlight the importance of coverage. Another key performance indication is the adhesion strength of the coating to the substrate, and a newly developed test method will be discussed, and where the adhesion challenges lie. Finally, measuring the whisker mitigation potential by coatings will be presented.

There increasingly is a desire to place electronics in high temperature environments, down well applications for example. Sintered silver joints once formed with their high melting point offer an attractive solution to the interconnect issue. To date sintered silver is not offered as an interconnect solution for surface mount assembly, but have found applications in high power semiconductors. Measuring the mechanical performance and the fatigue properties of these interconnects will be discussed.

Topics covered:

• Coating protection and barrier properties
• Coating coverage
• Coating adhesion
• Coating whisker mitigation
• Sintered silver interconnect assembly processes
• Sintered joint performance

The webinar will run from 14:30 hrs UK time (check local time in other countries here) - for between 45-60 minutes, and will include a Q&A session.

The NPL Electronics Interconnection (EI) Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker mitigation and conformal coating research.