NPL research in electronics interconnections is carried out in close collaboration with industry and is aimed at developing new test methods, guidelines and procedures for use in the assembly of microelectronics. The research is disseminated to industry by reports and industry advisory group meetings.
NPL has made considerable contributions to solderability testing, participating in the writing of IEC standard 68-2-69 and IPC J-Std 002 and 003.
Achieving high reliability is an increasingly critical issue in today's manufacture, now that very low defect levels in manufacture are obtainable. In order to keep up with the rapid developments in a global market, NPL offers a range of suitable measurement methods to refine the assembly process and thus remain competitive. Services offered include confidential advice, consultancy case studies in issues relevant to production reliability and a range of measurement service facilities.
News
Latest Meeting
Downloadable presentations from the Lead-Free Solder meeting held at NPL on 28 February 2008 are now available.
Please click here for access (password required).
Defects Database
NPL Electronics Interconnection Group is creating a Defects Database as part of their continuing support to the electronics industry. The database was suggested as an industry project by members of the Industry Advisory Group (IAG), recommending that NPL were best equipped to coordinate the activity due to their scientific and manufacturing expertise. By collecting together common problems and making example images freely available to industry it will assist engineers implement corrective actions in their process or design.
To access the database please click here
Microelectronics News
The latest issue of Microelectronics News is available here (PDF 302 KB)
For more information, please contact: Chris Hunt