National Physical Laboratory

Practical guide to soldering PCBs with high temperature solder alloys.


Hunt, C P, Willis, B*

Measurement Good Practice Guide No. 136, April 2015
NPL Doc. Ref:
PDB: 7486 | DDB: 7121
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Note: An asterisk after an author's name indicates a non-NPL author.


Over the past few years there has been a lot of discussion on the need for higher temperature materials and expanding the use and knowledge of high temperature assembly techniques. When we start to talk about high temperature electronics it is not just the solder alloy but all of the materials that go to produce an electronic assembly. Substrates, components, connectors, cables and solder need to be examined; the needs of the assembly process also require careful consideration. Often due to the smaller volumes many companies who require high temperature capability have used manual soldering techniques particularly for through hole. Working at high temperature generally means operating between 150 ºC-200 ºC; however, there are many applications that have to work at much higher levels, up to 300 ºC. Typically the industries affected by these hostile working conditions include, aerospace, automotive, petrochemical and military.

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