Class 10 and 1,000 Cleanroom Facilities - optical lithography, e-beam and thermal evaporation, wafer dicing saw and wire bonder : Nanomaterials : Research : Engineered Materials : Science + Technology : National Physical Laboratory

Class 10 and 1,000 Cleanroom Facilities - optical lithography, e-beam and thermal evaporation, wafer dicing saw and wire bonder

Class 10,000-cleanroom facility Class 1,000-cleanroom facility

Class 10 Cleanroom

ISO 5 standard

Optical lithography suite – wet etching, spin coating, mask alignment facilities
Temperature and humidity control (20±1ºC, 45 %rh)

Class 1,000 Cleanroom

ISO 7 standard

Thermal evaporation, e-beam and thermal deposition systems
Temperature and humidity control (20±1ºC, 45 %rh)
Thin film coating, and some semiconductor packaging process

Contact

Customer Service tel: 020 8943 8681
E-mail: materials_enquiries@npl.co.uk

Last Updated: 19 Mar 2012

Created: 7 Jul 2010

Engineered Materials

- Nanomaterials

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