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Electronics Interconnection

Electronics Interconnection Reports

If you are interested in any of these reports, please contact: Ling Zou

  1. Stencil Printing Codes of Practice, Christopher Hunt & Martin Wickham, CMMT (A) 165, February 1999
  2. Benchmarking Assisted & Automatic Optical Inspection of Electronic Assemblies, Martin Wickham & Christopher Hunt, CMMT (A) 173, April 1999
  3. Improving the Processability of Noble Metal Component Termination Finishes, Martin Wickham, Miloš Dušek, Ling Zou, Christopher Hunt, CMMT(A)199, August 1999
  4. Solderability Measurements with Lead-Free Alloys, Simon Green, Deborah Lea and Christopher Hunt, CMMT(A)213, August 1999
  5. The Impact of Solderability on Reliability and Yield of Surface Mount Assembly, Miloš Dušek & Christopher Hunt, CMMT(A)214, September 1999
  6. Optimum Pad Design and Solder Joint Shape for Reliability, Miloš Dušek & Christopher Hunt, CMMT(A)215, August 1999
  7. Influence of Rework Conditions on Microstructure in Tin-Lead Solder Joints, Simon Green & Christopher Hunt, CMMT(A)216, August 1999
  8. A Comparison of Automatic Optical Inspection and Automatic X-ray Inspection of Surface Mount Assemblies, Martin Wickham & Christopher Hunt, CMMT(A)234, August 1999
  9. The Effect of Test Voltage, Test Pattern and Board Finish on Surface Insulation Resistance (SIR) Measurements for Various Fluxes, Ling Zou & Christopher Hunt, CMMT(A)222, September 1999
  10. Development of a New Surface Insulation Resistance (SIR) Test Method, Christopher Hunt & Ling Zou, CMMT(A)235, December 1999
  11. Fine Pitch Paste Stencil Printing using Enclosed Printing Heads, Martin Wickham, Miloš Dušek & Christopher Hunt, CMMT(A)247, January 2000
  12. Tack Testing: Critique and Recommendations for a New Test, Christopher Hunt, CMMT(A)253, January 2000
  13. The Use of Shear Testing and Thermal Cycling for Assessment of Solder Joint Reliability, Miloš Dušek, Jaspal Nottay and Christopher Hunt, CMMT(A)268, June 2000
  14. A Test Methodology for Assessing Pb-free Solder Joint Reliability, Miloš Dušek, Jaspal Nottay, Christopher Hunt, CMMT(A)273, July 2000
  15. Best Practice Guide for Thermocycling and Reliability Assessment of Solder Joints, Miloš Dušek and Christopher Hunt, CMMT(A)274, July 2000
  16. Solderability of Electronic Components and Copper using Lead-Free Alloys, Deborah Lea, Milos Dusek, Fredirikus Jonck and Christopher Hunt, CMMT(A)284, September 2000
  17. Solderability Measurements of PCB Pad Finishes and Geometries, Deborah Lea, Fredirikus Jonck and Christopher Hunt, MATC(A)003, July 2001
  18. A novel measurement technique for stencil printed solder paste, Milos Dusek and Christopher Hunt, NPL MATC(A) 08
  19. Fine Pitch Stencil Printing Using Enclosed Printing Systems, Ling Zou,  Milos Dusek, Martin Wickham and  Christopher Hunt, MATC(A) 09, August 2001
  20. The Effect of Metal Content and Flux Chemistry on Fine Pitch Stencil Printing Performance using an Enclosed Print Head, Ling Zou, Milos Dusek, Martin Wickham and Christopher Hunt, MATC(A) 10, August 2001
  21.  An Experimental Validation of Modelling for Pb-free Solder Joint Reliability, Miloš Dušek, Jaspal Nottay, Christopher Hunt, Hua Lu and Christopher Bailey, MATC(A) 11, October 2001
  22. Technology Mission to Assess the Status of Lead-free Soldering in Japan, Christopher Hunt, MATC(A)012, March 2001
  23. The Effect of Solder Alloy, Metal Particle Size and Substrate Resist on Fine Pitch Stencil Printing Performance, Ling Zou, Milos Dusek, Martin Wickham and Christopher Hunt, MATC(A)018, August 2001
  24. Tack Testing of Solder Paste in Tension and Shear, Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)029, February 2001
  25. Tack of Electronic Adhesives in Tension and Shear, Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)030, April 2001
  26. Test Method for the Measurement of Tensile and Shear Tack for Electronic Solder Pastes and Adhesives, Alan Brewin, & Christopher Hunt, MATC(A)031, June 2001
  27. Processability of Lead-Free Component Termination Materials, Martin Wickham, Deborah Lea, Jaspal Nottay & Chris Hunt, MATC(A)47, August 2001
  28. Thermal Profiling of Electronic Assemblies, Martin Wickham and Christopher Hunt, MATC(A)50, August 2001
  29. Creep Properties of SnAgCu solder in Surface Mount Assemblies, Jaspal Nottay, Milos Dusek and Christopher Hunt, MATC(A)51, August 2001
  30. Stencil Printing of Surface Mount Adhesive and Conductive Adhesive, Ling Zou, Milos Dusek, Martin Wickham & Christopher Hunt, MATC(A)55
  31. A Review of Mechanical Test Method Standards for Lead-Free Solders, Martin Wickham, Jaspal Nottay and Christopher Hunt, MATC(A)69, October 2001
  32. Development of Surface Insulation Resistance Measurements for Electronic Assemblies, Christopher Hunt, MATC(A)70, October 2001
  33. Reworking Solder Alloy Mixtures of Lead-free and Tin-Lead Alloys, Jaspal Nottay, Milos Dusek, Martin Wickham and Christopher Hunt, MATC(A)73, October 2001
  34. Assessment of Rheological Properties of Materials used in Printing and Dispensing, Miloš Dušek and Christopher Hunt, MATC(A)76, December 2001
  35. Stability of Electronic Components in Lead-Free Processing, Alan Brewin, Ling Zou, and Christopher Hunt, MATC(A)79, December 2001
  36. Code of Practice for Electronic Materials Dispensing, Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)82, December 2001
  37. Predicting Microstructure of Mixed Solder Alloy Systems, Jaspal Nottay, Alan Brewin, Alan Dinsdale and Christopher Hunt, MATC(A)83, December 2001
  38. Reliability of Joints Formed with Mixed Alloy Solders, Alan Brewin, Christopher Hunt, Milos Dusek & Jaspal Nottay, MATC(A)85, April 2002
  39. Test Method for Dispensing of Electronic Process Materials, Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)86, March 2002
  40. Compatibility of Lead-free Solders with PCB Materials, Miloš Dušek, Jaspal Nottay and Christopher Hunt, MATC(A)89, August 2001
  41. An Assessment of the Suitability of Current PCB Laminates to Withstand Lead-free Reflow Profiles, Martin Wickham, Ling Zou and Christopher Hunt, MATC(A)91, April 2002
  42. A Review of Electronics Materials Deposition Techniques including Solder Jetting and Relief Printing, Martin Wickham, Ling Zou, Milos Dusek and Christopher Hunt, MATC(A)92, April 2002
  43. Rheology Testing of Solder Pastes and Conductive Adhesives Using in Stencil Printing, Miloš Dušek, Ling Zou and Christopher Hunt, MATC(A)102, May 2002
  44. Rework of Mixed Lead-Free Alloys - A Guide, Martin Wickham, Alan Brewin & Christopher Hunt, MATC(A)106, April 2002
  45. Test Methods for Evaluating the Reliability of PCB Finishes using Lead-Free Alloys - A Guide, Milos Dusek and Christopher Hunt, MATC(A)107, April 2002
  46. Rheology Testing of Solder Pastes and Conductive Adhesives – A Guide, Miloš Dušek, Ling Zou and Christopher Hunt, MATC(A)109, April 2002
  47. A Comparison of Automatic Optical Inspection Systems for use with Lead-Free Surface Mount Assemblies, Martin Wickham & Christopher Hunt, MATC(A)119, July 2002
  48. Test Procedure for Process Validation with Surface Insulation Resistance, Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)121, September 2002
  49. Development of New Solderability Test Fluxes, Alan Brewin, Ling Zou & Christopher Hunt, MATC(A)122, September 2002
  50. Design Guidelines for Ultra Fine Pitch Solder Paste Printing, Martin Wickham, Ling Zou, Milos Dusek, and  Christopher Hunt, MATC(A)127, September 2002
  51. A Test Procedure for Measurement of Solder Volume Effect on Reliability, Miloš Dušek and Christopher Hunt, MATC(A)128, September 2002
  52. A Test Procedure for Measuring Print Quality, Miloš Dušek and Christopher Hunt, MATC(A)129, September 2002
  53. Code of Practice for the Use of Electronic Components and PCBs in Lead-Free Processing, M Wickham, A Brewin, L Zou and C Hunt, MATC(A)141, April 2003
  54. Influence of Stencil and Aperture Design on Fine Pitch Printing for Various Solder Paste Types, M Wickham, L Zou, M Dusek and C P Hunt, MATC(A)145, September 2003
  55. The Impact of Thermal Cycle Regime on the Shear Strength of Lead-free Solder Joints, Milos Dusek, Martin Wickham & Christopher Hunt, NPL Report MATC(A)156, November 2003
  56. The Effect of Temperature on Microstructure of Lead-free Solder Joints, Thomas Le Toux, Milos Dusek & Christopher Hunt, NPL Report MATC(A)157, November 2003
  57. Analytical Model for Thermal Cycling, Milos Dusek & Christopher Hunt, NPL Report MATC(A)163, March 2004
  58. Crack Detection Methods for Lead-free Solder Joints, Milos Dusek & Christopher Hunt, NPL Report MATC(A) 164, March 2004
  59. Developing a Stress Screening Regime for Isotropic Electrically Conductive Adhesives, Martin Wickham, Ling Zou and Chris Hunt, NPL Report DEPC-MPR 005, July 2004
  60. Measurement of Creep Rates and Stress Relaxation for Micro-Sized Lead-Free Solder Joints, Milos Dusek & Chris Hunt, NPL Report DEPC-MPR 021, April 2005
  61. Shear Strength of Lead-Free Solder Joints, Milos Dusek, Martin Wickham and Christopher Hunt, NPL Measurement Note  MN57, March 2004
  62. Effect of PCB Finish, Processing and Micro-Structure on Lead-Free Solder Joint Reliability, M Dusek, M Wickham & C Hunt, NPL Report DEPC-MPR 028, September 2005
  63. Preliminary Measurements of Solder Flux Residues in an AC Environment, A Brewin, L Zou, M Dusek and C Hunt, NPL Report DEPC-MPR 029, August 2005
  64. Guidelines for Measuring Anionic Contamination of Printed Circuit Boards (PCB) & Circuit Assemblies (PCA) using Ion Chromatography, L Zou, A Brewin and C Hunt, Measurement Good Practice Guide No 76, July 2005
  65. Measuring the Reliability of Electronics Assemblies during the Transition Period to Lead-Free Soldering, M Wickham, L Zou, M Dusek And C Hunt, NPL Report DEPC-MPR 030, August 2005
  66. Measuring the Effect on Isotropic Electrically Conductive Adhesive Reliability of Substrate and Component Finishes, M Wickham, L Zou and C Hunt, NPL Report DEPC-MPR 031, August 2005
  67. The Role of Permeability and Ion Transport in Conformal Coating Protection, A Mensah and C Hunt, NPL Report DEPC-MPR 032, September 2005
  68. Effect of Voiding on Lead-Free Reliability, M Wickham, M Dusek, L Zou and C Hunt, NPL Report DEPC-MPR 033, April 2005
  69. Development of Preheat on Solderability Testing, L Zou and C P Hunt, NPL Report DEPC-MPR 036, September 2005
  70. Measuring the Impact of Component Solderability on Lead-Free Solder Joint Reliability, M Wickham, L Zou, M Dusek and C Hunt, DEPC-MPR 038, November 2005
  71. Solderability Testing with Components Preheating, L Zou and C Hunt, DEPC MN 038, December 2005
  72. The Analytical Model II for Predicting Solder Joint Shape and Volume Impact on Life-time, Miloš Dušek and Christopher Hunt, DEPC-MPR 039, November 2005
  73. Measuring the Impact of Land Size and Solder Joint Volume on Lead-free Solder Joint Reliability, M Wickham, L Zou, M Dusek and C P Hunt, DEPC-MPR 044, March 2006
  74. Measuring the Effect on Isotropic Electrically Conductive Adhesive Reliability of Joint Design Characteristics, M Wickham, L Zou and C P Hunt, DEPC-MPR 045, March 2006
  75. Measuring the Reliability of Technology Demonstrator Manufactured with Isotropic Electrically Conductive Adhesives, M Wickham, L Zou And C P Hunt, DEPC-MPR 046, December 2006
  76. Statistical Analysis of the Effect of PCB Finish and Processing of Solder Joint on Integrity, Miloš Dušek and Christopher Hunt, DEPC-MPR 047, March 2006
  77. Test Approach to Isothermal Fatigue Measurements for Lead-free Solders, Miloš Dušek and Christopher Hunt, DEPC-MPR 048, March 2006
  78. Protection Performance of Conformal Coatings in Harsh Environments, Ling Zou and Christopher Hunt, DEPC-MPR 054, July 2006
  79. Low Cycle Isothermal Fatigue Properties of Lead-free Solders, Miloš Dušek and Christopher Hunt, DEPC-MPR 058, January 2007
  80. Test Method for Conformal Coating Protection Performance of Electronic Assembly in Harsh Environments, Ling Zou and Christopher Hunt, DEPC-MPR 060, March 2007
  81. Susceptibility of Lead-Free Systems to Electrochemical Migration, Ling Zou and Christopher Hunt, MAT 1, May 2007
  82. Relative Reliability Measurements for Electrically Conductive Adhesive Joints on Subtractive Thermoplastic Substrates, M Wickham and C Hunt, MN 02, August 2007
  83. High-Frequency Vibration Tests of Sn-Pb and Lead-Free Solder Joints, D Di Maio and C Hunt, MAT 2, August 2007
  84. XRF Measurement of Residual Materials in Electronics, Martin Wickham and Christopher Hunt, MAT 4, October 2007
  85. Preliminary Measurements for Thermoplastic Electronics: Developing a Stress Screening Test, Martin Wickham, Ling Zou and Christopher Hunt, MAT 6, November 2007
  86. Reliability of Electronic Substrates after Processing at Lead-free Soldering Temperatures, Martin Wickham, Milos Dušek and Christopher Hunt, MAT 10, December 2007
  87. Electrochemical Impedance Technique to Predict Circuit Reliability with Lead-free Solders, Ling Zou and Christopher Hunt, MAT 15, March 2008
  88. Test Method for Recyclable Electronic Substrates Utilising Additive Technology, Martin Wickham, Ling Zou and Christopher Hunt, MAT 16, February 2008
  89. On-wafer Testing of PCB Tracks as CPW Lines as a Production Assessment Method for Anisotropic Conductive Film Bonding, Martin Wickham, Martin Salter, Nick Ridler, Milos Dušek and Christopher Hunt, MAT 18, April 2008

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